Issued Patents 2025
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432859 | Surface mount device bonded to an inner layer of a multi-layer substrate | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hem Takiar | 2025-09-30 |
| 12431418 | Three dimensional semiconductor trace length matching and associated systems and methods | Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2025-09-30 |
| 12412811 | Split via structure for semiconductor device packaging | Seng Kim Ye, Kelvin Tan Aik Boo, Ling Pan, See Hiong Leow | 2025-09-09 |
| 12374612 | Microelectronic device packages and related methods and systems | Kelvin Tan Aik Boo, Wen Wei Lum | 2025-07-29 |
| 12368113 | Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices | Faxing Che, Yeow Chon Ong, Wei Yu, Ling Pan, Lin-Kai Bu | 2025-07-22 |
| 12362247 | Semiconductor devices with flexible spacer including a support structure and methods of making the same | Faxing Che, Wei Yu, Yeow Chon Ong, Shin Yueh Yang | 2025-07-15 |
| 12362319 | Cross stack bridge bonding devices and associated methods | Seng Kim Ye, Kelvin Tan Aik Boo, Chin Hui Chong | 2025-07-15 |
| 12362255 | Apparatus including direct-contact heat paths and methods of manufacturing the same | Kelvin Tan Aik Boo, Seng Kim Ye, Chin Hui Chong | 2025-07-15 |
| 12354939 | Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the same | Chin Hui Chong, Kelvin Tan Aik Boo, Seng Kim Ye | 2025-07-08 |
| 12315769 | Build-up package for integrated circuit devices, and methods of making same | Choon Kuan Lee, David J. Corisis, Chin Hui Chong | 2025-05-27 |
| 12293992 | Semiconductor assemblies with systems and methods for managing high die stack structures | Kelvin Tan Aik Boo, Seng Kim Ye, Chin Hui Chong | 2025-05-06 |
| 12243807 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Chin Hui Chong, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2025-03-04 |
| 12237301 | Through stack bridge bonding devices and associated methods | Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2025-02-25 |