Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432859 | Surface mount device bonded to an inner layer of a multi-layer substrate | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2025-09-30 |
| 12243807 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2025-03-04 |