Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412811 | Split via structure for semiconductor device packaging | Hong Wan Ng, Seng Kim Ye, Kelvin Tan Aik Boo, Ling Pan | 2025-09-09 |
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Overall (2025): #222,937 of 469,880Top 50%
1
Patents 2025