Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412811 | Split via structure for semiconductor device packaging | Hong Wan Ng, Seng Kim Ye, Kelvin Tan Aik Boo, See Hiong Leow | 2025-09-09 |
| 12368113 | Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices | Faxing Che, Hong Wan Ng, Yeow Chon Ong, Wei Yu, Lin-Kai Bu | 2025-07-22 |
| 12355167 | Connection designs for memory systems | Wei Yu | 2025-07-08 |