Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368113 | Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices | Faxing Che, Hong Wan Ng, Yeow Chon Ong, Wei Yu, Ling Pan | 2025-07-22 |