Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315769 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong | 2025-05-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315769 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, Chin Hui Chong | 2025-05-27 |