Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388026 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, I-Hsuan Peng | 2025-08-12 |
| 12334444 | Semiconductor package structure and method for forming the same | Po-Hao Chang, Hung-Chuan Chen | 2025-06-17 |
| 12198996 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Tzu-Jui Fang, Po-Yao Chuang | 2025-01-14 |