Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334444 | Semiconductor package structure and method for forming the same | Yi-Jou Lin, Hung-Chuan Chen | 2025-06-17 |
| 12249599 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Jun Zhai, Hsien-Che Lin, Ying-Chieh Ke +1 more | 2025-03-11 |