Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368137 | High bandwidth die to die interconnect with package area reduction | Chonghua Zhong, Kunzhong Hu | 2025-07-22 |
| 12322730 | Wafer reconstitution and die-stitching | Sanjay Dabral, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2025-06-03 |
| 12283549 | High density interconnection using fanout interposer chiplet | Chonghua Zhong, Kunzhong Hu | 2025-04-22 |
| 12261132 | Structure and method for sealing a silicon IC | Vidhya Ramachandran, Sanjay Dabral, SivaChandra Jangam, Kunzhong Hu | 2025-03-25 |
| 12249599 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke +1 more | 2025-03-11 |