Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424455 | Seal ring designs supporting efficient die to die routing | Chi Nung Ni, Long Huang, SivaChandra Jangam | 2025-09-23 |
| 12322730 | Wafer reconstitution and die-stitching | Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2025-06-03 |
| 12261132 | Structure and method for sealing a silicon IC | Vidhya Ramachandran, SivaChandra Jangam, Jun Zhai, Kunzhong Hu | 2025-03-25 |
| 12237269 | Scalable large system based on organic interconnect | Ravindranath Kollipara | 2025-02-25 |