Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368137 | High bandwidth die to die interconnect with package area reduction | Jun Zhai, Kunzhong Hu | 2025-07-22 |
| 12283549 | High density interconnection using fanout interposer chiplet | Jun Zhai, Kunzhong Hu | 2025-04-22 |