Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400871 | Metal lines with low via-to-via spacing | Daniel James Dechene, Hsueh-Chung Chen, Carl Radens, Lawrence A. Clevenger | 2025-08-26 |
| 12394660 | Buried power rail after replacement metal gate | Devika Sarkar Grant, Sagarika Mukesh, Kisik Choi, Ruilong Xie | 2025-08-19 |
| 12268031 | Backside power rails and power distribution network for density scaling | Ruilong Xie, Kisik Choi, Sagarika Mukesh, Albert M. Chu, Albert M. Young +6 more | 2025-04-01 |