Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400871 | Metal lines with low via-to-via spacing | Daniel James Dechene, Somnath Ghosh, Carl Radens, Lawrence A. Clevenger | 2025-08-26 |
| 12402329 | Top via containing random-access memory cross-bar array | Koichi Motoyama, Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2025-08-26 |
| 12374615 | Electronic devices with a low dielectric constant | Su Chen Fan, Dechao Guo, Carl Radens, Indira Seshadri | 2025-07-29 |
| 12369494 | MRAM top electrode structure with liner layer | Koichi Motoyama, Chanro Park, Yann Mignot, Chih-Chao Yang | 2025-07-22 |
| 12243770 | Hard mask removal without damaging top epitaxial layer | Chanro Park, Yann Mignot, Daniel J. Vincent, Su Chen Fan, Christopher J. Waskiewicz | 2025-03-04 |