Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406920 | Top via interconnect with airgap | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2025-09-02 |
| 12400912 | Dual-damascene fav interconnects with dielectric plug | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2025-08-26 |
| 12402329 | Top via containing random-access memory cross-bar array | Koichi Motoyama, Hsueh-Chung Chen, Chanro Park, Chih-Chao Yang | 2025-08-26 |
| 12356638 | Metal-insulator-metal capacitor structure with enlarged capacitor area | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2025-07-08 |
| 12341100 | Copper interconnects with self-aligned hourglass-shaped metal cap | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2025-06-24 |
| 12315807 | Reducing copper line resistance | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2025-05-27 |
| 12266607 | Bottom barrier free interconnects without voids | Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha, Joe Lee | 2025-04-01 |