Issued Patents 2025
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12433170 | MRAM structure with a T-shaped ferromagnetic layer | Oscar van der Straten, Chih-Chao Yang | 2025-09-30 |
| 12406920 | Top via interconnect with airgap | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2025-09-02 |
| 12402536 | Magneto-resistive random access memory with hemispherical top electrode | Oscar van der Straten, Scott A. DeVries, Chih-Chao Yang | 2025-08-26 |
| 12400698 | MRAM device with octagon profile | Oscar van der Straten, Chih-Chao Yang | 2025-08-26 |
| 12400859 | Metal hard mask for precise tuning of mandrels | Joe Lee, Yann Mignot, Christopher J. Penny | 2025-08-26 |
| 12400912 | Dual-damascene fav interconnects with dielectric plug | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2025-08-26 |
| 12402329 | Top via containing random-access memory cross-bar array | Hsueh-Chung Chen, Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2025-08-26 |
| 12382840 | Damascene MRAM device | Oscar van der Straten, Chih-Chao Yang | 2025-08-05 |
| 12369494 | MRAM top electrode structure with liner layer | Hsueh-Chung Chen, Chanro Park, Yann Mignot, Chih-Chao Yang | 2025-07-22 |
| 12356638 | Metal-insulator-metal capacitor structure with enlarged capacitor area | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2025-07-08 |
| 12349598 | MRAM device structure | Oscar van der Straten, Chih-Chao Yang | 2025-07-01 |
| 12347767 | Stacked FET contact formation | Ruilong Xie, Jennifer Church, Oleg Gluschenkov | 2025-07-01 |
| 12349597 | Conical magnetic random access memory pillar structures | Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2025-07-01 |
| 12342726 | Etching of magnetic tunnel junction (MTJ) stack for magnetoresistive random-access memory (MRAM) | Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2025-06-24 |
| 12341100 | Copper interconnects with self-aligned hourglass-shaped metal cap | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2025-06-24 |
| 12315807 | Reducing copper line resistance | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2025-05-27 |
| 12317752 | MRAM structure with multilayer encapsulation | Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2025-05-27 |
| 12266607 | Bottom barrier free interconnects without voids | Kenneth Chun Kuen Cheng, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha, Joe Lee | 2025-04-01 |