Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400933 | Jet impingement heatsink for high power semiconductor devices | Changsun YUN | 2025-08-26 |
| 12368085 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Seungwon IM, Dongwook Kang | 2025-07-22 |
| 12315826 | Semiconductor device package assemblies with direct leadframe attachment | Seungwon IM | 2025-05-27 |
| 12272615 | Thermal mismatch reduction in semiconductor device modules | Seungwon IM | 2025-04-08 |
| 12266590 | Dual side direct cooling semiconductor package | Inpil Yoo, Jerome Teysseyre, Keunhyuk LEE, Michael J. Seddon | 2025-04-01 |
| 12230601 | High power module package structures | Seungwon IM, Jooyang EOM, Inpil Yoo | 2025-02-18 |
| 12230606 | Semiconductor package and related methods | Seungwon IM, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2025-02-18 |
| 12230551 | Immersion direct cooling modules | Youngsun KO, Seungwon IM, Jerome Teysseyre, Michael J. Seddon | 2025-02-18 |