Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | Adel A. Elsherbini, William J. Lambert, Shawna M. Liff, Nicolas Butzen, Georgios Dogiamis +4 more | 2025-09-02 |
| 12381029 | Stepped coax MIL PTHS for modulating inductance within a package | Brandon C. Marin, Haifa Hariri, Tarek A. Ibrahim | 2025-08-05 |
| 12342454 | Computing system with cooling for controlling temperature of electronic components | Unnikrishnan Vadakkanmaru Veedu, Silvia Anali Soto De La Torre, Alexander Lyakhov, Fenghua Shen, Madhavi Tadepalli | 2025-06-24 |
| 12336196 | Magnetic core inductors on package substrates | Wei-Lun Kane Jen, Huong Do, Amruthavalli Pallavi Alur | 2025-06-17 |
| 12308362 | Packaging architecture for disaggregated integrated voltage regulators | Kaladhar Radhakrishnan, William J. Lambert, Adel A. Elsherbini, Sriram Srinivasan, Christopher Schaef | 2025-05-20 |
| 12288750 | Conformal power delivery structure for direct chip attach architectures | William J. Lambert, Beomseok Choi, Kaladhar Radhakrishnan, Adel A. Elsherbini | 2025-04-29 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, William J. Lambert, Kaladhar Radhakrishnan, Adel A. Elsherbini, Henning Braunisch +3 more | 2025-03-04 |
| 12224252 | Magnetic core inductors in interposer | William J. Lambert, Haifa Hariri, Siddharth Kulasekaran, Mathew J. Manusharow, Anne Augustine | 2025-02-11 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Han Wui Then, Kimin Jun, Aleksandar Aleksov, Mohammad Enamul Kabir +3 more | 2025-01-14 |