Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424559 | Package with a substrate comprising embedded escape interconnects and surface escape interconnects | Kuiwon Kang, Michelle Yejin Kim | 2025-09-23 |
| 12381174 | Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods | Aniket PATIL, Joan Rey Villarba BUOT | 2025-08-05 |
| 12243855 | Package comprising channel interconnects located between solder interconnects | Aniket PATIL, Durodami LISK, Charles David Paynter | 2025-03-04 |
| 12230552 | Recess structure for padless stack via | Joan Rey Villarba BUOT, Aniket PATIL | 2025-02-18 |