Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381174 | Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods | Aniket PATIL, Hong Bok We | 2025-08-05 |
| 12362269 | Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods | Michelle Yejin Kim, Kuiwon Kang, Ching-Liou Huang | 2025-07-15 |
| 12230552 | Recess structure for padless stack via | Hong Bok We, Aniket PATIL | 2025-02-18 |