Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424559 | Package with a substrate comprising embedded escape interconnects and surface escape interconnects | Kuiwon Kang, Hong Bok We | 2025-09-23 |
| 12362269 | Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods | Kuiwon Kang, Joan Rey Villarba BUOT, Ching-Liou Huang | 2025-07-15 |