Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424559 | Package with a substrate comprising embedded escape interconnects and surface escape interconnects | Hong Bok We, Michelle Yejin Kim | 2025-09-23 |
| 12362269 | Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods | Michelle Yejin Kim, Joan Rey Villarba BUOT, Ching-Liou Huang | 2025-07-15 |
| 12354935 | Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods | Chin-Kwan Kim, Joonsuk Park | 2025-07-08 |