Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354935 | Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods | Kuiwon Kang, Chin-Kwan Kim | 2025-07-08 |
| 12302556 | Semiconductor device and method of fabricating the same | Dong-Wan Kim, Keonhee Park, Dong-Sik Park, Jihoon Chang, Hyeon-Woo Jang | 2025-05-13 |