Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354935 | Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods | Kuiwon Kang, Joonsuk Park | 2025-07-08 |
| 12300873 | Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods | Suhyung Hwang, Kun Fang, Jaehyun Yeon, Taesik Yang | 2025-05-13 |
| 12293980 | Package comprising discrete antenna device | Jaehyun Yeon, Suhyung Hwang, Rajneesh Kumar, Darryl Sheldon JESSIE | 2025-05-06 |