Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381174 | Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT | 2025-08-05 |
| 12288710 | Wafer processing apparatus with a rotatable table | Theodorus G.M. Oosterlaken, Nimit Kothari | 2025-04-29 |
| 12243855 | Package comprising channel interconnects located between solder interconnects | Durodami LISK, Hong Bok We, Charles David Paynter | 2025-03-04 |
| 12230552 | Recess structure for padless stack via | Hong Bok We, Joan Rey Villarba BUOT | 2025-02-18 |