Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243855 | Package comprising channel interconnects located between solder interconnects | Aniket PATIL, Hong Bok We, Charles David Paynter | 2025-03-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243855 | Package comprising channel interconnects located between solder interconnects | Aniket PATIL, Hong Bok We, Charles David Paynter | 2025-03-04 |