Issued Patents 2025
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12433170 | MRAM structure with a T-shaped ferromagnetic layer | Koichi Motoyama, Oscar van der Straten | 2025-09-30 |
| 12414480 | MRAM bottom electrode contact with taper profile | Ashim Dutta, Saumya Sharma, Tianji Zhou | 2025-09-09 |
| 12414312 | Back-end-of-line thin film resistor | Baozhen Li, Ashim Dutta, Huimei Zhou | 2025-09-09 |
| 12406920 | Top via interconnect with airgap | Kenneth Chun Kuen Cheng, Koichi Motoyama, Chanro Park | 2025-09-02 |
| 12402536 | Magneto-resistive random access memory with hemispherical top electrode | Oscar van der Straten, Koichi Motoyama, Scott A. DeVries | 2025-08-26 |
| 12400698 | MRAM device with octagon profile | Oscar van der Straten, Koichi Motoyama | 2025-08-26 |
| 12400912 | Dual-damascene fav interconnects with dielectric plug | Chanro Park, Kenneth Chun Kuen Cheng, Koichi Motoyama | 2025-08-26 |
| 12402329 | Top via containing random-access memory cross-bar array | Koichi Motoyama, Hsueh-Chung Chen, Chanro Park, Kenneth Chun Kuen Cheng | 2025-08-26 |
| 12389803 | Magnetoresistive random-access memory (MRAM) with preserved underlying dielectric layer | Ashim Dutta, Shyng-Tsong Chen, Terry A. Spooner | 2025-08-12 |
| 12382840 | Damascene MRAM device | Koichi Motoyama, Oscar van der Straten | 2025-08-05 |
| 12369494 | MRAM top electrode structure with liner layer | Hsueh-Chung Chen, Koichi Motoyama, Chanro Park, Yann Mignot | 2025-07-22 |
| 12363913 | Fabrication of embedded memory devices utilizing a self assembled monolayer | Ashim Dutta, Ekmini Anuja De Silva | 2025-07-15 |
| 12356638 | Metal-insulator-metal capacitor structure with enlarged capacitor area | Chanro Park, Koichi Motoyama, Kenneth Chun Kuen Cheng | 2025-07-08 |
| 12349597 | Conical magnetic random access memory pillar structures | Oscar van der Straten, Koichi Motoyama, Joseph F. Maniscalco | 2025-07-01 |
| 12349598 | MRAM device structure | Koichi Motoyama, Oscar van der Straten | 2025-07-01 |
| 12341100 | Copper interconnects with self-aligned hourglass-shaped metal cap | Koichi Motoyama, Chanro Park, Kenneth Chun Kuen Cheng | 2025-06-24 |
| 12342726 | Etching of magnetic tunnel junction (MTJ) stack for magnetoresistive random-access memory (MRAM) | Koichi Motoyama, Oscar van der Straten, Joseph F. Maniscalco | 2025-06-24 |
| 12341066 | Advanced metal interconnect | Ashim Dutta, Lawrence A. Clevenger, Ruilong Xie | 2025-06-24 |
| 12327770 | Probe pad with built-in interconnect structure | Ashim Dutta, Ruturaj Nandkumar Pujari, Saumya Sharma | 2025-06-10 |
| 12324358 | Tall bottom electrode structure in embedded magnetoresistive random-access memory | Ashim Dutta, Lili Cheng | 2025-06-03 |
| 12315807 | Reducing copper line resistance | Chanro Park, Kenneth Chun Kuen Cheng, Koichi Motoyama | 2025-05-27 |
| 12317752 | MRAM structure with multilayer encapsulation | Oscar van der Straten, Koichi Motoyama, Joseph F. Maniscalco | 2025-05-27 |
| 12289896 | Magneto-resistive random access memory with segmented bottom electrode | Oscar van der Straten, Willie Lester Muchrison, JR., Lisamarie White | 2025-04-29 |
| 12266605 | Top via interconnects with line wiggling prevention | Tao Li, Ruilong Xie, Tsung-Sheng Kang | 2025-04-01 |
| 12250827 | Magneto-resistive random access memory with substitutional bottom electrode | Oscar van der Straten, Lisamarie White, Willie Lester Muchrison, JR. | 2025-03-11 |