| 12414480 |
MRAM bottom electrode contact with taper profile |
Saumya Sharma, Tianji Zhou, Chih-Chao Yang |
2025-09-09 |
| 12414312 |
Back-end-of-line thin film resistor |
Baozhen Li, Chih-Chao Yang, Huimei Zhou |
2025-09-09 |
| 12389803 |
Magnetoresistive random-access memory (MRAM) with preserved underlying dielectric layer |
Shyng-Tsong Chen, Terry A. Spooner, Chih-Chao Yang |
2025-08-12 |
| 12363913 |
Fabrication of embedded memory devices utilizing a self assembled monolayer |
Ekmini Anuja De Silva, Chih-Chao Yang |
2025-07-15 |
| 12341066 |
Advanced metal interconnect |
Chih-Chao Yang, Lawrence A. Clevenger, Ruilong Xie |
2025-06-24 |
| 12327770 |
Probe pad with built-in interconnect structure |
Ruturaj Nandkumar Pujari, Saumya Sharma, Chih-Chao Yang |
2025-06-10 |
| 12324358 |
Tall bottom electrode structure in embedded magnetoresistive random-access memory |
Lili Cheng, Chih-Chao Yang |
2025-06-03 |
| 12277960 |
Modified top electrode contact for MRAM embedding in advanced logic nodes |
Dominik Metzler, Oscar van der Straten, Theodorus E. Standaert |
2025-04-15 |
| 12272545 |
Embedded metal contamination removal from BEOL wafers |
Devika Sil, Yann Mignot, John C. Arnold, Daniel C. Edelstein, Kedari Matam +1 more |
2025-04-08 |
| 12243771 |
Selective patterning of vias with hardmasks |
John C. Arnold, Dominik Metzler, Timothy Mathew Philip, Sagarika Mukesh |
2025-03-04 |
| 12219881 |
Dual layer top contact for magnetic tunnel junction stack |
Chih-Chao Yang |
2025-02-04 |
| 12207561 |
MRAM device with wrap-around top electrode |
Shravana Kumar Katakam, Chih-Chao Yang |
2025-01-21 |
