Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424560 | Semiconductor chip device | Chia-Hao Cheng, Kong-Toon Ng, Rahul Agarwal | 2025-09-23 |
| 12374645 | Electronic device including dies and an interconnect coupled to the dies and processes of forming the same | Lei Fu, Raja Swaminathan | 2025-07-29 |
| 12276850 | Fanout module integrating a photonic integrated circuit | Raja Swaminathan, Kong-Toon Ng, Rahul Agarwal | 2025-04-15 |
| 12278150 | Semiconductor package with annular package lid structure | Priyal Shah, Raja Swaminathan | 2025-04-15 |
| 12266585 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore | 2025-04-01 |
| 12266611 | Mixed density interconnect architectures using hybrid fan-out | Rahul Agarwal, Raja Swaminathan | 2025-04-01 |
| 12249519 | Molded chip package with anchor structures | Priyal Shah, Milind S. Bhagavat, Lei Fu, Rahul Agarwal | 2025-03-11 |