Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394683 | Molded semiconductor chip package with stair-step molding layer | Rahul Agarwal, Milind S. Bhagavat, Chia-Hao Cheng | 2025-08-19 |
| 12278150 | Semiconductor package with annular package lid structure | Brett P. Wilkerson, Raja Swaminathan | 2025-04-15 |
| 12249519 | Molded chip package with anchor structures | Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu, Rahul Agarwal | 2025-03-11 |