Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374645 | Electronic device including dies and an interconnect coupled to the dies and processes of forming the same | Raja Swaminathan, Brett P. Wilkerson | 2025-07-29 |
| 12249519 | Molded chip package with anchor structures | Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Rahul Agarwal | 2025-03-11 |