Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394683 | Molded semiconductor chip package with stair-step molding layer | Priyal Shah, Rahul Agarwal, Chia-Hao Cheng | 2025-08-19 |
| 12266585 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Kaushik Mysore, Brett P. Wilkerson | 2025-04-01 |
| 12249519 | Molded chip package with anchor structures | Priyal Shah, Brett P. Wilkerson, Lei Fu, Rahul Agarwal | 2025-03-11 |