Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424560 | Semiconductor chip device | Kong-Toon Ng, Rahul Agarwal, Brett P. Wilkerson | 2025-09-23 |
| 12394683 | Molded semiconductor chip package with stair-step molding layer | Priyal Shah, Rahul Agarwal, Milind S. Bhagavat | 2025-08-19 |