Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Gang Duan +9 more | 2025-07-08 |