Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062625 | Semiconductor device package mold flow control system and method | Hua Tan, Kent Yang, Weiting Jiang, Jerry Tang, Simon Dong +2 more | 2024-08-13 |
| 12027497 | Semiconductor device with unbalanced die stackup | Haiyue Shen, Fen Yu, Donghua Wu, Hua Tan, Xinyu Wang +1 more | 2024-07-02 |
| 12021060 | Reducing keep-out-zone area for a semiconductor device | Kevin Du, Zengyu Zhou, Alex Zhang, Vincent Jiang, Shixing Zhu +3 more | 2024-06-25 |
| 12021061 | Packaged memory device with flip chip and wire bond dies | Rui Yuan, Paul Qu, Kevin Du, Zengyu Zhou, Yi-Hsuan Su +1 more | 2024-06-25 |
| 11942459 | Semiconductor device package with exposed bond wires | Hua Tan, Weiting Jiang, Elley Zhang, Cong Zhang, Simon Dong +2 more | 2024-03-26 |