Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021060 | Reducing keep-out-zone area for a semiconductor device | Kevin Du, Hope Chiu, Alex Zhang, Vincent Jiang, Shixing Zhu +3 more | 2024-06-25 |
| 12021061 | Packaged memory device with flip chip and wire bond dies | Rui Yuan, Hope Chiu, Paul Qu, Kevin Du, Yi-Hsuan Su +1 more | 2024-06-25 |
| 11917761 | Tombstone prevention for a surface mount device | Joyce Chen, Lynn Lin, Emma Wang, Linda Huang, Cong Zhang +1 more | 2024-02-27 |