Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021060 | Reducing keep-out-zone area for a semiconductor device | Hope Chiu, Zengyu Zhou, Alex Zhang, Vincent Jiang, Shixing Zhu +3 more | 2024-06-25 |
| 12021061 | Packaged memory device with flip chip and wire bond dies | Rui Yuan, Hope Chiu, Paul Qu, Zengyu Zhou, Yi-Hsuan Su +1 more | 2024-06-25 |