Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154860 | Method of forming a semiconductor device including vertical contact fingers | Zhongli Ji, Ning Ye, Chin-Tien Chiu | 2024-11-26 |
| 12027497 | Semiconductor device with unbalanced die stackup | Haiyue Shen, Hope Chiu, Donghua Wu, Hua Tan, Xinyu Wang +1 more | 2024-07-02 |