NY

Ning Ye

WT Western Digital Technologies: 7 patents #20 of 549Top 4%
AB Asml Netherlands B.V.: 2 patents #82 of 543Top 20%
II Intrinsic Innovation: 2 patents #14 of 57Top 25%
ST Sandisk Technologies: 2 patents #93 of 398Top 25%
Samsung: 1 patents #7,344 of 17,120Top 45%
Overall (2024): #4,253 of 561,600Top 1%
15
Patents 2024

Issued Patents 2024

Patent #TitleCo-InventorsDate
12154860 Method of forming a semiconductor device including vertical contact fingers Zhongli Ji, Chin-Tien Chiu, Fen Yu 2024-11-26
12130891 Method of live video event detection based on natural language queries, and an apparatus for the same Zhiming Hu, Caleb Ryan Phillips, Iqbal I. Mohomed 2024-10-29
12128563 Machine-learnable robotic control plans Maryam Bandari, Klas Jonas Alfred Kronander, Bala Venkata Sai Ravi Krishna Kolluri, Jianlan Luo, Wenzhao Lian +1 more 2024-10-29
12125669 Thermal-aided inspection by advanced charge controller module in a charged particle system Jun Jiang, Jian Zhang, Yixiang Wang 2024-10-22
12105036 Method and apparatus for monitoring beam profile and power Jian Zhang, DanJing Huang, Bin-Da Chan 2024-10-01
12068041 Power reallocation for memory device Shrikar Bhagath, Dean M. Jenkins, Hedan Zhang, Bret Winkler 2024-08-20
12033958 Semiconductor device including a suspended reinforcing layer and method of manufacturing same Yangming Liu, Shenghua Huang, Bo Yang, Cong Zhang 2024-07-09
12016111 Protective enclosure for an electronic device Chun Sean Lau, Ahmad Faridzul Hilmi Shamsuddin, Bo Yang, Shankara Venkatraman Gopalan, Warren Middlekauff 2024-06-18
12013749 Failed temperature sensor detection and mitigation within data storage devices Hedan Zhang, Chaolun Zheng, Bret Winkler, Yanjun Xia, Wei Wu 2024-06-18
11986958 Skill templates for robotic demonstration learning Bala Venkata Sai Ravi Krishna Kolluri, Stefan Schaal, Benjamin Davis, Ralf Oliver Michael Schönherr 2024-05-21
11985782 Enclosure fitting for electronic device Bo Yang, Warren Middlekauff, Sean Lau, Shrikar Bhagath, Yangming Liu 2024-05-14
11978713 Flip chip bump with multi-PI opening Shenghua Huang, Yangming Liu, Bo Yang 2024-05-07
11961778 Semiconductor device package having multi-layer molding compound and method Shenghua Huang, Yangming Liu, Bo Yang 2024-04-16
11908495 Electronic device with heat transfer pedestal having optimized interface surface and associated methods Bo Yang, Yuhang Yang 2024-02-20
11898267 Nonlinear optical crystal fluorine boron beryllium salt and its preparation process and use Guang Peng, Min Luo, Ge Zhang, Yu-Te Chen 2024-02-13