Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033958 | Semiconductor device including a suspended reinforcing layer and method of manufacturing same | Yangming Liu, Bo Yang, Ning Ye, Cong Zhang | 2024-07-09 |
| 12027497 | Semiconductor device with unbalanced die stackup | Haiyue Shen, Fen Yu, Hope Chiu, Donghua Wu, Hua Tan +1 more | 2024-07-02 |
| 11978713 | Flip chip bump with multi-PI opening | Yangming Liu, Bo Yang, Ning Ye | 2024-05-07 |
| 11961778 | Semiconductor device package having multi-layer molding compound and method | Yangming Liu, Bo Yang, Ning Ye | 2024-04-16 |