Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033958 | Semiconductor device including a suspended reinforcing layer and method of manufacturing same | Shenghua Huang, Bo Yang, Ning Ye, Cong Zhang | 2024-07-09 |
| 11985782 | Enclosure fitting for electronic device | Bo Yang, Warren Middlekauff, Sean Lau, Ning Ye, Shrikar Bhagath | 2024-05-14 |
| 11978713 | Flip chip bump with multi-PI opening | Shenghua Huang, Bo Yang, Ning Ye | 2024-05-07 |
| 11961778 | Semiconductor device package having multi-layer molding compound and method | Shenghua Huang, Bo Yang, Ning Ye | 2024-04-16 |