Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154860 | Method of forming a semiconductor device including vertical contact fingers | Zhongli Ji, Ning Ye, Fen Yu | 2024-11-26 |
| 12051660 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang | 2024-07-30 |
| 11901260 | Thermoelectric semiconductor device and method of making same | Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Wenbin Qu | 2024-02-13 |