Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051660 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu | 2024-07-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051660 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu | 2024-07-30 |