Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942459 | Semiconductor device package with exposed bond wires | Hua Tan, Hope Chiu, Weiting Jiang, Cong Zhang, Simon Dong +2 more | 2024-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942459 | Semiconductor device package with exposed bond wires | Hua Tan, Hope Chiu, Weiting Jiang, Cong Zhang, Simon Dong +2 more | 2024-03-26 |