Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062625 | Semiconductor device package mold flow control system and method | Hope Chiu, Hua Tan, Kent Yang, Weiting Jiang, Jerry Tang +2 more | 2024-08-13 |
| 11942459 | Semiconductor device package with exposed bond wires | Hua Tan, Hope Chiu, Weiting Jiang, Elley Zhang, Cong Zhang +2 more | 2024-03-26 |