Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11991824 | Circuit board structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Shao-Chien Lee, Ming-Ru Chen +1 more | 2024-05-21 |
| 11943877 | Circuit board structure and manufacturing method thereof | Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko +2 more | 2024-03-26 |
| 11923350 | Light emitting diode package structure | Ming-Ru Chen, Cheng-Chung Lo | 2024-03-05 |
| 11860428 | Package structure and optical signal transmitter | John Hon-Shing Lau | 2024-01-02 |