Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185479 | Flexible circuit board and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Shih-Chieh Chen, Jeng-Ting Li | 2024-12-31 |
| 12062742 | Package structure and manufacturing method of the same | Hao-Wei Tseng, Jeng-Ting Li, Ying Chen, Pu-Ju Lin, Cheng-Ta Ko | 2024-08-13 |
| 11991824 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Shao-Chien Lee, Ming-Ru Chen +1 more | 2024-05-21 |
| 11955587 | Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device | Jeng-Ting Li, Cheng-Ta Ko, Pu-Ju Lin | 2024-04-09 |