Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11991824 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Shao-Chien Lee +1 more | 2024-05-21 |
| 11923350 | Light emitting diode package structure | Tzyy-Jang Tseng, Cheng-Chung Lo | 2024-03-05 |