Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185479 | Flexible circuit board and manufacturing method thereof | Pu-Ju Lin, Shih-Chieh Chen, Chi-Hai Kuo, Jeng-Ting Li | 2024-12-31 |
| 12160953 | Circuit board structure and manufacturing method thereof | Kai-Ming Yang, Chia-Yu Peng, Pu-Ju Lin | 2024-12-03 |
| 12062742 | Package structure and manufacturing method of the same | Hao-Wei Tseng, Chi-Hai Kuo, Jeng-Ting Li, Ying Chen, Pu-Ju Lin | 2024-08-13 |
| 11991824 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Pu-Ju Lin, Chi-Hai Kuo, Shao-Chien Lee, Ming-Ru Chen +1 more | 2024-05-21 |
| 11955587 | Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device | Jeng-Ting Li, Chi-Hai Kuo, Pu-Ju Lin | 2024-04-09 |
| 11943877 | Circuit board structure and manufacturing method thereof | Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Pu-Ju Lin, Chin-Sheng Wang +2 more | 2024-03-26 |
| 11895780 | Manufacturing method of package structure | Kai-Ming Yang, Chen-Hao Lin, Wang-Hsiang Tsai | 2024-02-06 |