Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160953 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, Cheng-Ta Ko, Pu-Ju Lin | 2024-12-03 |
| 11943877 | Circuit board structure and manufacturing method thereof | Wen-Yu Lin, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko, Chin-Sheng Wang +2 more | 2024-03-26 |
| 11895780 | Manufacturing method of package structure | Chen-Hao Lin, Wang-Hsiang Tsai, Cheng-Ta Ko | 2024-02-06 |