Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11943877 | Circuit board structure and manufacturing method thereof | Wen-Yu Lin, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Chin-Sheng Wang +2 more | 2024-03-26 |
| 11895780 | Manufacturing method of package structure | Kai-Ming Yang, Wang-Hsiang Tsai, Cheng-Ta Ko | 2024-02-06 |